High temperature face plate for deposition application

ABSTRACT

Embodiments of the disclosure relate to faceplates for a processing chamber. In one example, a faceplate includes a body having a plurality of apertures formed therethrough. A heating element is disposed within the body, and the heating element circumscribes the plurality of apertures. A support ring is disposed in the body. The support ring circumscribes the heating element. The support ring includes a main body and a cantilever extending radially inward from the main body. The cantilever contacts the body of the faceplate.

BACKGROUND Field

Embodiments of the present disclosure generally relate to a heatedfaceplate for use in substrate processing chambers.

Description of the Related Art

In the fabrication of integrated circuits, deposition processes such aschemical vapor deposition (CVD) or atomic layer deposition (ALD) areused to deposit films of various materials upon semiconductorsubstrates. In other operations, a layer altering process, such asetching, is used in a repetitive fashion to fabricate various layers ofan electronic device, such as a semiconductor device.

Fabricating a defect free semiconductor device is desirable whenassembling integrated circuits and as the need for improved devicescontinues to grow, so too does the need for improved methods andapparatuses for manufacturing such devices. The chemistry used in newprocesses, such as precursor gases, is continually requiring increasedprocess control, such as temperature control, to carry out suchprocesses to predetermined specifications. Accordingly, there is a needin the art for process chamber components that can provide increasedtemperature control for device manufacturing and processing.

SUMMARY

In one embodiment, a faceplate for a processing chamber comprises a bodyhaving a plurality of apertures formed therethrough; a heating elementdisposed within the body, the heating element circumscribing theplurality of apertures; and a support ring disposed in the body, thesupport ring circumscribing the heating element, the support ringincluding a main body and a cantilever extending radially inward fromthe main body, the cantilever contacting the body of the faceplate.

In another embodiment, a faceplate for a processing chamber comprises abody having a plurality of apertures formed therethrough, the bodycomprising a first extension and a second extensions each extendingoutward from an outer surface of the body, the first extension and thesecond extension together defining a recess, each of the first extensionand the second extension have a greater thickness at a radially outwardedge thereof compared to a radially inward edge thereof. The faceplatealso comprises a heating element disposed within the body, the heatingelement circumscribing the plurality of apertures, the heating elementlocated radially inward of the first extension and the second extension.The faceplate additionally comprises a support ring disposed in therecess of the body, the support ring comprising a main body andcircumscribing the heating element, wherein the radially outward edge ofeach of the first and second extensions is in contact with the supportring, and the radially inward edge of each of the first and secondsupport rings is spaced apart from the support ring.

In another embodiment, a process chamber comprises a chamber body; asubstrate support disposed in the chamber body; and a lid assemblydisposed on the chamber body, the lid assembly comprising: a body havinga plurality of apertures formed therethrough; a heating element disposedwithin the body, the heating element circumscribing the plurality ofapertures; and a support ring disposed in the body, the support ringcircumscribing the heating element, the support ring including a mainbody and a cantilever extending radially inward from the main body, thecantilever contacting the body of the faceplate.

BRIEF DESCRIPTION OF THE DRAWINGS

So that the manner in which the above recited features of the presentdisclosure can be understood in detail, a more particular description ofthe disclosure, briefly summarized above, may be had by reference toembodiments, some of which are illustrated in the appended drawings. Itis to be noted, however, that the appended drawings illustrate onlyexemplary embodiments and are therefore not to be considered limiting ofscope, as the disclosure may admit to other equally effectiveembodiments.

FIG. 1A illustrates a schematic, cross-sectional view of a processchamber according to one embodiment of the present disclosure.

FIG. 1B illustrates an enlarged, partial view of the process chamber ofFIG. 1A.

FIG. 2 illustrates an enlarged, partial view of the process chamber 100of FIGS. 1A and 1B according to one embodiment of the presentdisclosure. In particular, FIG. 2 illustrates faceplate 138 adjacent theblocker plate 136 and the side wall 104 of the chamber body 102.

FIG. 3 illustrates an enlarged view of a coupling portion of thefaceplate depicted in FIG. 2.

FIG. 4 illustrates a temperature of the faceplate according to oneembodiment of the present disclosure.

FIG. 5A illustrates a view of a faceplate assembly, according to anotherembodiment of the disclosure.

FIG. 5B illustrates a perspective view of one embodiment of a supportring.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. It is contemplated that elements and features of oneembodiment may be beneficially incorporated in other embodiments withoutfurther recitation.

DETAILED DESCRIPTION

Embodiments of the present disclosure generally relate to an apparatusfor gas distribution in a process chamber. More specifically, aspects ofthe present disclosure relate to a metal faceplate. The faceplate has abody formed from a distribution portion surrounded by a couplingportion. A heater is disposed within the distribution portion to heatthe body to an elevated temperature. A support ring is disposed withinthe coupling portion of the faceplate. A cantilever extends from thesupport ring, creating a load bearing point to support the faceplate.Gaps are disposed between the support ring and the faceplate. The gapsact as thermal chokes and limit heat transfer between the distributionportion and the coupling portion of the faceplate.

FIG. 1A illustrates a schematic cross-sectional view of a processchamber 100 according to one embodiment. FIG. 1B illustrates anenlarged, schematic view of details of the process chamber 100. Theprocess chamber 100 includes a body 102 having a side wall 104 and abase 106. A lid assembly 108 is coupled to the body 102. The body 102and lid assembly 108 define process volume 110. The body 102 is formedfrom a metallic material, such as aluminum or stainless steel, but othermaterial suitable for use with the process therein is contemplated. Asubstrate support 112 is disposed with the process volume 110 andsupports a substrate 114 during processing. The substrate support 112includes a support body 116 coupled to a shaft 118. The shaft 118 iscoupled to a lower surface of the support body 116 and extends out ofthe body 102 through an opening 120 in the base 106. The shaft 118 iscoupled to an actuator 122. The actuator 122 vertically actuates theshaft 118, and support body 116 coupled thereto, between a substrateloading position and a substrate processing position. To facilitateprocessing of a substrate 114 in the process chamber 100, the substrate114 is disposed on an upper surface of the support body 116 opposite ofthe shaft 118.

A port 124 is formed in the side wall 104 to facilitate ingress andegress of the substrate 114 into the process volume 110. A door 126,such as a slit valve, is actuated to selectively enable the substrate114 to pass through the port 124 to be loaded onto, or removed from, thesupport body 116. An electrode 128 is optionally disposed within thesupport body 116 and electrically coupled to a power source 130 throughthe shaft 118. The electrode 128 is selectively biased by the powersource 130 to create an electromagnetic field to chuck the substrate 114to the support body 116. In certain embodiments, a heater 133, such as aresistive heater, is disposed within the support body 116 to heat thesubstrate 114 disposed thereon.

An inlet port 174 is disposed within the lid 134. The inlet port 174 isfluidly coupled to a gas conduit 146. The gas conduit 146 enables a gasto flow from a first gas source 148, such as a process gas source,through the inlet port 174 into the first volume 140. A second gassource 150, may supply a cleaning gas in order to remove particledepositions from internal surfaces of the processing chamber 100. A seal180, such as an O-ring, is disposed in a groove, such as a dovetailgroove, between the blocker plate 136 and the lid 134 at the annularextension 172 in order to isolate the process volume 110 from theexternal environment, enabling maintenance of the vacuum therein by thevacuum system 132.

A vacuum system 132 is fluidly coupled to the process volume 110 inorder to evacuate gases from the process volume 110.

The lid assembly 108 includes a lid 134, a blocker plate 136, afaceplate 138, and a clamp 135. The blocker plate 136 includes arecessed circular distribution portion 170 surrounded by an annularextension 172. The blocker plate is disposed between the lid 134 and thefaceplate 138 and is coupled to the lower surface 141 of the lid 134 andthe upper surface 149 of the faceplate 138 at the annular extension 172.The clamp 135 is coupled to the lower surface of the lid 134, the outersurface 143 of the blocker plate 136, the outer edge 145 of the supportring 158 (shown in FIG. 2), and the upper surface 105 of the side wall104. The clamp 135 facilitates securing the faceplate 138. The lid 134couples to the upper surface 137 of the annular extension 172 oppositethe body 102. The faceplate 138 couples to the lower surface 139 of theannular extension 172. A first volume 140 is defined between the blockerplate 136 and the lid 134. A second volume 142 is defined between theblocker plate 136 and the lower portion 151 of the faceplate 138. Aplurality of apertures 144 are formed through the distribution portion170 of the blocker plate 136 and facilitate fluid communication betweenthe first volume 140 and the second volume 142.

The faceplate 138 has a distribution portion 176 and a coupling portion178 (shown in FIG. 2) disposed radially outward of the distributionportion 176. The distribution portion 176 is disposed between theprocess volume 110 and the second volume 142 and facilitates fluid flowthere between. The coupling portion 178 surrounds the distributionportion 176 at a periphery of the faceplate 138. To facilitateprocessing of a substrate 112, a RF generator 182 may be coupled to thefaceplate 138 to excite a gas from the first gas source 148, the secondgas source 150, or both the first gas source 148 and the second gassource 150 to form an ionized species. In one embodiment, the RFgenerator 182 and the faceplate 138, in conjunction with the electrode128, facilitate generation of a capacitively coupled plasma within theprocess volume 110.

One or more apertures 152 are disposed through the faceplate 138 withinthe distribution portion 176. The apertures 152 enable fluidcommunication between the second volume 142 and the process volume 110.In operation, a gas flows from the inlet port 174 into the first volume140, through the plurality of apertures 144 in the blocker plate 136into the second volume 142, through the plurality of apertures 152 inthe faceplate 138, and into process volume 110. The arrangement andsizing of apertures 152 enable the selective flow of the gas into theprocess volume 110 in order to achieve the desired gas distribution. Inone embodiment, a uniform gas distribution may be desired and that isachieved by the selective flow of gas into the process volume 110.

One or more heating elements 160 are disposed in the faceplate 138. Inone embodiment, the heating elements 160 are disposed radially outwardof the apertures 152. The heating elements 160 may be any elementcapable of providing heat to the faceplate 138. In one embodiment, theheating element 160 includes a resistive heater, which may be embeddedwithin and encircling the apertures 152 of the faceplate 138. Theheating element 160 heats the faceplate 138 to a high temperature, suchas 300° C. and higher. For example the heating element 160 may heat thefaceplate to 400° C., 500° C., or higher. Increasing the temperature ofthe faceplate 138 during processing to a temperature of 300° C., 400°C., 500° C., or higher results in reduced particle formation on thefaceplate 138 which translates to improved deposition on, and processingof, substrate 114, while also increasing tool uptime.

FIG. 2 illustrates an enlarged, partial view of the process chamber 100of FIG. 1A according to one embodiment of the present disclosure. Inparticular, FIG. 2 illustrates faceplate 138 adjacent the blocker plate136 and the side wall 104 of the chamber body 102.

A recess 153 is formed in the radially outward edge of coupling portion178 of the faceplate 138. A support ring 158 is disposed within therecess 153 formed in the coupling portion 178 of the faceplate 138. Thesupport ring 158 is disposed radially outward of both the distributionportion 176 and the heating element 160 of the faceplate 138. Seals 154and 156 are disposed above and below coupling portion 178 of thefaceplate 138. Seals 154 and 156 are disposed within dovetailed groovesin the blocker plate 136 and chamber support 104. Seals 154 and 156 maybe O-rings that provide a vacuum seal to the process volume 110. Thesupport ring 158 provides structural and coupling support of thefaceplate 138. The support ring 158 is composed of a material such as,but not limited to, aluminum, aluminum oxide, aluminum nitride, siliconoxide, silicon nitride, or stainless steel. The support ring 158 has amain body 161, a lip 162 disposed on the outer edge 145 of the supportring 158. The lip 162 extends radially outward from the support ring 158and facilitates handling the faceplate 138 during preventativemaintenance.

The support ring 158 additionally includes a radially inward cantilever164. The cantilever 164 is positioned opposite the lip 162, and extendsradially inward from an inner surface 163 of the support ring 158. Thecantilever 164 provides structural support and a weight-bearing surfacefor the faceplate 138. For example, the cantilever 164 prevents droopingof the faceplate 138, resulting in improved deposition and increaseduniformity and processing of substrate 112. Minimum contact and thelower thermal conductivity of the support ring 158 traps heat within thefaceplate 138 resulting in limited power used to heat the faceplate andhelps in meeting the thermal budget target.

FIG. 3 illustrates an enlarged view of a coupling portion 178 of thefaceplate 138 depicted in FIG. 2. As shown in FIG. 3, the support ring158 engages a recess 153 formed around the circumference of thefaceplate 138. The faceplate includes a stepped surface whichcorresponds to the shape of the radially inward surface of the supportring 158. To facilitate assembly of the faceplate 138 and the supportring 158, the support ring 158 may be formed from multiple segmentswhich can be assembled to form a complete loop around the faceplate 138.

When the support ring 158 is assembled with the faceplate 138, thesupport ring 158 makes contact with the faceplate 138 only in selectedlocations within the recess 153, which minimizes heat transfer therebetween. For example, the support ring 158 contacts the faceplate 138 at(1) a top surface 184 of the cantilever 164; (2) a radially outward edgeof the upper surface 165 of the main body 161 of the support ring 158;and (3) a radially outward edge of the lower surface 167 of the mainbody 161 of the support ring 158. The top surface 184 of the cantilever164 is the load bearing structure of the support ring 158. In oneembodiment which can be combined with other embodiments, the cantilever164 has a nominal thickness of about 8 millimeters (mm) to 20 mm. Inanother embodiment, cantilever 164 is about 10 mm thick.

In locations within the recess 153 in which the edge support ring 158does not contact the faceplate 138, gaps, such as gaps 190, 192 a, and192 b, are formed. Gaps 190, 192 a, and 192 b are spaces disposedradially between the faceplate 138 and the support ring 158. Gap 190 isdisposed between the cantilever 164 and the side wall 185 of the recess153. In one embodiment, as depicted in FIG. 3, gap 192 a is disposedbetween the inner surface 163 a of the support ring 158 and extends atleast partially over the upper surface 165 of the main body 161 of thesupport ring 158 and gap 192 b is disposed between the inner surface 163b and extends at least partially under the lower surface 167 of the mainbody 161 of the support ring 158. In another embodiment, gap 192 a isdisposed between the inner surface 163 a of the support ring 158 and thestepped lower surface of the extension 186. Gap 192 b is disposedbetween the inner surface 163 b of the support ring 158 and the steppedupper surface of the extension 188. Gaps 190, 192 a, and 192 b minimizethe contact area between the faceplate 138 and the support ring 158 tolimit heat transfer from the heating element 160 to the seals 154, 156to prevent degradation thereof, keeping the temperature of the seals154, 156 low (e.g., below a degradation temperature thereof) andreducing the power requirement to the heating element 160. The gaps 190,192 a, and 192 b provide thermal choking and additionally provide spacefor thermal expansion. In one embodiment which can be combined withother embodiments, the width of the gaps 190, 192 a, or 192 b is about0.1 mm to 5 mm, such as about 0.5 mm to 2 mm. It is understood that thesize, shape, and arrangement of the gaps 190, 192 a, 192 b disposedaround the support ring 158 may be selected in relation to desired rateof heat transfer across the coupling portion 178. Further, the depth,width, and cross section of the gaps 190, 192 a, and 192 b may beadjusted as desired. Any arrangement of gaps, channels, grooves,recesses, or cutouts capable of minimizing heat transfer may be utilizedas thermal breaks.

The coupling portion 178 has extensions 186 and 188 which partiallydefine recess 153. Extensions 186 and 188 provide a primary thermalchoking feature of the design. The decreased cross sectional area ofextensions 186 and 188 provide reduced thermal conduction resulting inthermal choking within the coupling portion 178. The extension 186 has aplanar upper surface and a stepped lower surface. The planar uppersurface of the extension 186 is adjacent to the lower surface 139 of theblocker plate 136. The extension 186 extends over the upper surface 165of the main body 161 of the support ring 158. The extension 186 is atleast partially in contact with the upper surface 165 of the main body161 of the support ring 158. The stepped lower surface 189 of theextension 186 is located between the radially inward surface of thesupport cantilever 164 and the faceplate 138. The extension 188 has aplanar lower surface and a stepped upper surface. The planar lowersurface of the extension 188 is adjacent to the upper surface 105 of theside wall 104. The extension 188 extends below the bottom surface of thesupport ring 158. The extension 188 is at least partially in contactwith the bottom surface of support ring 158. The extensions 186 and 188provide thermal choking from the distribution portion 176 to thecoupling portion 178 by creating additional gaps above/below the mainbody 161 due to the presence of the respective stepped surface. Thethermal choking provided by the extensions 186, 188 limit heat transferfrom heating element 160 to vacuum seals 154 and 156. Extensions 186 and188 are thin-walled portions of the faceplate 138. In one embodimentwhich can be combined with other embodiments, extensions 186 and 188have a nominal thickness of about 0.5 mm to 5 mm such as about 0.5 mm to3 mm thick. It is understood that the depth, width, and cross section ofthe extensions 186 and 188 disposed around the support ring 158 may beselected in relation to desired rate of heat transfer across thecoupling portion 178.

Gaps 193 a and 193 b are also utilized as thermal breaks. Gaps 193 aprovides a thermal break between the blocker plate 136 and the extension186. Gap 193 a is defined by a recess disposed in the lower surface 139of blocker plate 136 adjacent to vacuum seal 154. Gap 193 b provides athermal break between the side wall 104 and the extension 188. The gap193 b is defined by a recess in the upper surface 105 of the side wall104 adjacent to vacuum seal 156. The depth, width, and cross section ofgaps 193 a and 193 b may be selected in relation to desired rate of heattransfer from the faceplate 138 to seals 154 and 156.

FIG. 4 depicts a temperature gradation across a faceplate 400. The 400is similar to faceplate 138. The temperature is warmest at region 402which includes the distribution portion 176 (shown in FIG. 1A) offaceplate 400. The temperature cools gradually in the radially outwarddirection such that region 412 may have the coolest temperature onfaceplate 400. The faceplate 400, as depicted in FIG. 4, has regions402, 404, 406, 408, 410, and 412 depicting different temperatures acrossfaceplate 400. FIG. 4 is an exemplary embodiment and there may be feweror more regions. In an exemplary embodiment, as depicted in FIG. 4, thetemperature of region 402 may be about 350° C. or greater. Thetemperature of region 404 may be about 25° C.-40° C. less than that ofthe temperature of region 402, such that the temperature of region 404may be about 310° C.-325° C. Region 406 includes at least a portion ofthe coupling portion 178 (shown in FIG. 1) of the faceplate 400. Thetemperature of region 406 may be about 10-15° C. less than thetemperature of region 404, such that region 406 has a temperature ofabout 300° C. The temperature of region 408 is about 270° C.-280° C. Thetemperature of region 408 is about 20° C.-30° C. cooler than region 406.The lower temperature of region 408 is due to the gaps 190, 192 a, and192 b (shown in FIG. 3). The temperature of region 410 is about 180°C.-210° C. The temperature of region 412 is about 150° C.-170° C.

FIG. 5A is a cross sectional view of a faceplate assembly 500. Thefaceplate assembly 500 may include one or more aspects described abovewithout further recitation.

The faceplate assembly 500 is a modular assembly including one or morecomponents. For example, the faceplate assembly includes a first supportsection 558 a and a second support section 558 b, which together form aring when engaged with one another. In one example, the first supportsection 558 a and the second support section 558 b each extend 180degrees. However, other dimensions are contemplated. The first supportsection 558 a and the second support section 558 b surround and secure afaceplate 138. A concentric heating element 560 is embedded within thefaceplate 138 to facilitate heating of the faceplate 138. In oneexample, the faceplate 138 is made by adhering (e.g., welding orbrazing) two plates together, with the heating element 560 positioned atthe interface therebetween. The concentric heating element 560 hasconnecting ends 562 extending form the faceplate 138 to facilitateconnection to a power source. The connecting ends 562 are positioned inrespective openings 594 formed in the support section 558. The supportsection 558 a may have corresponding openings 594, which facilitatepositioning the connecting ends 562 in a direction which is 180 degreesfrom that illustrated in FIG. 5A. Thus, the faceplate assembly 500 canbe used in chambers of various configurations (such as in dual chamberplatforms), without the need for chamber-specific components. Althoughthe openings 594 are positioned about 90 degrees from adjoining surfacesof the first and second support sections 558 a, 558 b, other locationsare also contemplated.

Temperature sensors 508 (four are shown) are disposed through the eachsupport section 558 a, 558 b. Temperature sensors 508 are used fordetermining and regulating the temperature of the faceplate 138. In oneexample, the temperature sensors flank the openings 594. It iscontemplated that more or less than four temperature sensors 508 may beutilized.

The first and second support sections 558 a and 558 b are connected withan installation bracket 506. The installation bracket 506 connects thesupport rings 558 a, 558 b by adhering to adjacent lips 162 on the firstand second support sections 558 a, 558 b. In one example, each of thefirst support section 558 a and the second support section 558 bincludes two lips 162, positioned at lateral ends of the first supportsection 158 a and the second support section 158. A plurality of holes504 are formed through each lip 162 and through the installation bracket506, and aligned with one another to accommodate a fastener therein.Each lip 162 also includes one or more notches 502 (two are shown ineach lip 162) that are used for locating and clamping the faceplate 138within a processing chamber 100 (as shown in FIG. 1A).

FIG. 5B depicts one embodiment of a support section 558 a (with supportsection 558 b being a mirror image). The support ring 558 a includes amain body 561 and one or more lips 162 (two are shown) disposed on theouter edge 145 of the support section 558 a. The lip 162 extendsradially outward from the support section 558 a and facilitates handlingof a faceplate 138 (shown in FIG. 5A).

In one embodiment depicted in FIG. 5B, the cantilever of the supportsection 558 a is divided into a plurality of segmented cantilevers 564a-564 f. The plurality of cantilevers 564 a-564 f operate similarly tothe cantilever 164 shown in FIG. 3. The plurality of cantilevers 564a-564 f extend from the inner surface 563 of the support section 558 a.The plurality of cantilevers 564 a-564 f provide a greater surface arearesulting in greater thermal choking efficiency, while maintainingspacing therebetween to reduce thermal mass. Openings 594 are formedthrough the inner surface of the support ring 158. The connecting ends562 of the heating element 560 may be disposed with the openings 594.

The embodiments described herein advantageously provide a faceplatecapable of being heated to high temperatures, such as above 350° C.,with minimal droop or sagging. The thermal choke as disclosed allows thetemperature of the faceplate to be increased to a high temperature,limiting the deposition of contaminant particles, while maintaining thesealing capabilities of the outboard disposed seals.

While the forgoing is directed to embodiments of the present disclosure,other and further embodiments of the disclosure may be devised withoutdeparting from the basic scope thereof, and the scope thereof isdetermined by the claims that follow.

What is claimed is:
 1. A faceplate for a processing chamber, comprising:a body having a plurality of apertures formed therethrough; a heatingelement disposed within the body, the heating element circumscribing theplurality of apertures; and a support ring disposed in the body, thesupport ring circumscribing the heating element, the support ringincluding a main body and a cantilever extending radially inward fromthe main body, the cantilever contacting the body of the faceplate. 2.The faceplate of claim 1, wherein the body comprises aluminum and thesupport ring comprises aluminum, aluminum oxide, aluminum nitride,silicon oxide, silicon nitride, or stainless steel.
 3. The faceplate ofclaim 1, further wherein a gap is formed between a radially inwardsurface of the cantilever and the body of the faceplate.
 4. Thefaceplate of claim 1, further wherein a gap formed between a lowersurface of the cantilever and the body of the faceplate.
 5. Thefaceplate of claim 1, further wherein a first gap is formed between aradially inward surface of the main body of the support ring and thebody of the faceplate, and a second gap is formed between an uppersurface of the main body and the body of the faceplate.
 6. The faceplateof claim 5, wherein the first gap and second gap are each within a rangeof about 0.1 mm to 5 mm.
 7. The faceplate of claim 1, wherein athickness of the cantilever is within a range of about 8 mm to 20 mm. 8.The faceplate of claim 1, wherein the body comprises a first extensionand a second extensions each extending outward from an outer surface ofthe body, the first extension and the second extension together defininga recess for receiving the support ring.
 9. The faceplate of claim 8,each of the first extension and the second extension have a greaterthickness at a radially outward edge thereof compared to a radiallyinward edge thereof.
 10. The faceplate of claim 9, wherein the radiallyoutward edge of each of the first and second extensions is in contactwith the support ring, and the radially inward edge of each of the firstand second extensions is spaced apart from the support ring.
 11. Afaceplate for a processing chamber, comprising: a body having aplurality of apertures formed therethrough, the body comprising a firstextension and a second extension each extending outward from an outersurface of the body, the first extension and the second extensiontogether defining a recess, each of the first extension and the secondextension have a greater thickness at a radially outward edge thereofcompared to a radially inward edge thereof; a heating element disposedwithin the body, the heating element circumscribing the plurality ofapertures, the heating element located radially inward of the firstextension and the second extension; and a support ring disposed in therecess of the body, the support ring comprising a main body andcircumscribing the heating element, wherein the radially outward edge ofeach of the first and second extensions is in contact with the supportring, and the radially inward edge of each of the first and secondextensions is spaced apart from the support ring.
 12. The faceplate ofclaim 11, wherein the body comprises aluminum and the support ringcomprises aluminum, aluminum oxide, aluminum nitride, silicon oxide,silicon nitride, or stainless steel.
 13. The faceplate of claim 12,wherein the support ring further comprises a cantilever extendingradially inward from the main body.
 14. The faceplate of claim 13,further wherein a gap is formed between a radially inward surface of thecantilever and the body of the faceplate.
 15. The faceplate of claim 14,wherein the gap is within a range of about 0.1 mm to 5 mm.
 16. Thefaceplate of claim 14, further wherein a gap formed between a lowersurface of the cantilever and the body of the faceplate.
 17. Thefaceplate of claim 16, wherein the gap is within a range of about 0.1 mmto 5 mm.
 18. A process chamber, comprising: a chamber body; a substratesupport disposed in the chamber body; and a lid assembly disposed on thechamber body, the lid assembly comprising: a faceplate comprising: abody having a plurality of apertures formed therethrough; a heatingelement disposed within the body, the heating element circumscribing theplurality of apertures; and a support ring disposed in the body, thesupport ring circumscribing the heating element, the support ringincluding a main body and a cantilever extending radially inward fromthe main body, the cantilever contacting the body of the faceplate. 19.The faceplate of claim 18, wherein the body comprises aluminum and thesupport ring comprises aluminum, aluminum oxide, aluminum nitride,silicon oxide, silicon nitride, or stainless steel.
 20. The faceplate ofclaim 18, further wherein a gap is formed between a radially inwardsurface of the cantilever and the body of the faceplate.